Huang Mian

Huang Mian, a distinguished engineer and innovator, serves as Co-Founder and Chief Product Officer (CPO) at All Safe. With a rich background in research and development, Huang Mian brings his expertise in integrated circuit technology, electronic system miniaturization, and high-density packaging to drive product development and innovation at All Safe.

Huang Mian holds a Bachelor's degree in Communication Engineering and a Master's degree in Physical Electronics from Huazhong University of Science and Technology. His academic background laid the foundation for his extensive research and development career, which has spanned across leading institutes such as the Shenzhen Institute of Advanced Technology and the Institute of Microelectronics at the Chinese Academy of Sciences.

As a project leader for numerous national initiatives and special projects, Huang Mian has overseen the development and industrialization of high-density packaging flip-chip substrate products, sensor network core chips, and other cutting-edge technologies. His work has led to the application of over 30 domestic and international patents, with 18 invention patents granted. Huang Mian has also authored a professional monograph, "Cadence System-in-Package Design: Allegro SiP/APD Design Guide," and published more than ten research papers.

Huang Mian's contributions to the industry include the construction of China's first board-level fan-out integrated packaging production line for power chips, overcoming high power, high heat dissipation, and low parasitic parameter challenges in board-level fan-out packaging technology.

As the CPO of All Safe, Huang Mian leads the development of innovative safety management solutions, leveraging his extensive expertise in integrated circuit technology and electronic system miniaturization to ensure All Safe's products remain at the forefront of the industry.